W958D6NW 256Mb HyperRAM 3.0 x16 WLCSP30 数据表-A01-007-202303

简介：
这是一份关于W958D6NW型号，容量为256Mb的HyperRAM 3.0芯片的数据手册。该器件采用WLCSP30封装形式，文档版本A01，更新日期为2023年3月7日。 ### W958D6NW 256Mb HyperRAM 3.0 x16 WLCSP30 Datasheet Overview The W958D6NW 256Mb HyperRAM 3.0 x16 is a high-performance memory device developed by Winbond Electronics Corporation. This detailed datasheet provides comprehensive information on the technical specifications, operational characteristics, and usage guidelines for this component. Below are key aspects of the datasheet: #### 1. Features The W958D6NW offers several advanced features tailored to modern embedded systems demands: - **High Density**: It has a storage capacity of 256Mb (32M x 8). - **HyperRAM Interface**: This interface is optimized for low-pin count applications and supports fast data transfer rates. - **Low Power Consumption**: Designed for battery-powered devices, it consumes minimal power. - **Compact Form Factor**: The WLCSP30 package ensures a compact solution. - **Fast Access Time**: It achieves rapid access times to enhance system performance. - **Extended Temperature Range**: Operates reliably across various environmental conditions. #### 2. Ordering Information The datasheet provides detailed ordering information for the W958D6NW, including: - **Part Number**: W958D6NW - **Package Type**: WLCSP30 - **Capacity**: 256Mb - **Interface**: HyperRAM 3.0 - **Data Width**: x16 - **Revision**: A01-007 - **Publication Release Date**: March 14, 2023 These details are essential for ensuring the correct part is ordered and used in intended applications. #### 3. Ball Assignment The ball assignment section outlines the pin layout of the WLCSP30 package: - **Pin Configuration**: A diagram indicating each pins location and function. - **Signal Types**: Pins categorized by signal type such as address, data, control signals etc. #### 4. Ball Descriptions This section provides detailed descriptions for individual pins: - **Clock Signals**: Manage timing operations within the device. - **Address Signals**: Specify memory locations where data is stored or retrieved. - **Data Signals**: Carry actual data to and from the memory array. - **Control Signals**: Handle commands like read, write, chip enable. #### 5. Block Diagram The block diagram illustrates internal architecture: - **Memory Array**: Stores data. - **Address Decoder**: Decodes address signals for selecting memory locations. - **Data Path**: Manages data flow between the memory array and external interfaces. #### 6. Functional Description This section explains operational principles of W958D6NW, covering: - General Overview: Capabilities and basic modes of operation. - HyperBus Extend IO: Details on enhanced features including additional IO functionalities supported by the interface. #### 7. HyperBus-Extend-IO Transaction Details HyperBus Extend IO transactions involve specific command-address bit assignments and sequences for efficient data transfer: - **Command Address Bit Assignments**: Specific bits assigned to various commands and addresses. - **Transaction Sequences**: Detailed procedures for read, write operations etc. In conclusion, the W958D6NW 256Mb HyperRAM 3.0 x16 WLCSP30 datasheet is a comprehensive guide enabling engineers and developers to effectively utilize this high-performance memory device in their projects by studying features, ordering information, pin assignments, functional descriptions, and transaction details.