VPX标准规范属于VITA46.0草案之一。

简介：
This standard outlines the VITA 46.0 Advanced Module Format, representing a significant progression in the delivery of high-speed interconnects specifically tailored for demanding operational environments. The Foreword details that VME has long served as the established, de facto bus standard for Commercial off the Shelf (COTS) Circuit Card Assemblies since the 1980s. VME boards have consistently demonstrated an impressive ability to adapt and evolve to support emerging technologies, incorporating advancements like the VME Subsystem Bus, PCI Mezzanine Cards (PMCs), and VME320. Nevertheless, recent developments in technology, particularly within the realm of interconnects, have highlighted a clear requirement for an advancement in system design. This necessary evolution must effectively manage high-speed interconnects—especially serial interconnects—while also accommodating increased power delivery alongside improved thermal dissipation capabilities. This draft standard specifically tackles these requirements within the framework of IEEE 1101 form factor modules. Complementary specifications may also address alternative physical configurations, such as VITA-48 (Draft). Considering the ongoing trend of electronics miniaturization driving an increase in plug-in module I/O counts, most system interconnects will necessitate: * Multi-gigabit differential technology * Core computing cluster switched fabrics * Serial RapidIO, PCI Express, and Advanced Switching Interconnect solutions * An adequate number of ports to facilitate distributed or centralized switching architectures. The diverse array of available high-speed interfaces for future plug-in modules includes: * Network interfaces (such as Fibre Channel, 10 GbE XAUI, and Infiniband) * Digital video interfaces (including TMDS, PanelLink, and OpenLDI) * Mass storage interfaces (such as Fibre Channel and Serial ATA) * FPGA-based inter-board connections (for example, Xilinx RocketIO) * Custom sensor interfaces. VITA 46 provides a progressive pathway for VME users to utilize a wide range of high-speed interconnect technologies. It ensures backward compatibility with existing VME bus electrical specifications, software protocols, and selected mechanical aspects. Furthermore, it enables heterogeneous architectures while preserving valuable investments in current COTS-based systems. The standard addresses both 3U and 6U form factors with shared commonalities. It incorporates a robust design philosophy focused on suitability for harsh environments – including features “designed-in” from the outset – utilizing rugged air or conduction-cooled form factors and prioritizing rear-panel I/O connectivity alongside high-speed connector survivability and compliance standards.