这份PDF文档详尽介绍了USB 3.0规范的各项技术细节和标准，旨在帮助开发者与制造商更好地理解和应用该接口技术。
Acknowledgement of USB 3.0 Technical Contribution
1 Introduction
1.1 Motivation
The motivation for this document is to acknowledge the technical contributions made in developing and implementing USB 3.0 technology.
1.2 Objective of the Specification
This section outlines the primary objectives behind creating a comprehensive specification for USB 3.0, aimed at enhancing data transfer rates and overall system performance compared to previous versions like USB 2.0.
1.3 Scope of the Document
The document covers various aspects such as architectural overviews, system-level topologies, bus protocols, robustness features, error detection mechanisms, hub architectures among others related specifically to SuperSpeed USB (USB 3.0).
1.4 USB Product Compliance
It details compliance requirements for products adhering to USB 3.0 standards ensuring they meet necessary specifications and quality criteria.
1.5 Document Organization
The document is organized into several chapters each focusing on different critical aspects of USB 3.0 technology including terms, abbreviations, architectural overviews, system level topologies etc.
1.6 Design Goals
This section lays out the design goals for SuperSpeed USB with emphasis on improving data transfer speeds and power efficiency while maintaining compatibility with existing USB standards.
1.7 Related Documents
It lists other relevant documents that provide additional information or serve as references when understanding specific aspects of this specification.
2 Terms and Abbreviations
3 SuperSpeed USB Architectural Overview
3.1 USB 3.0 Overview
This part provides a high-level summary introducing the concept of SuperSpeed architecture in USB technology.
3.1.1 SuperSpeed Architecture Overview
Describes key components including physical layer, link layer, protocol layer and hubs.
3.1.1.1 Physical Layer
Details about hardware specifications for data transmission at this level.
3.1.1.2 Link Layer
Explains how data is organized into packets and transmitted between devices via this intermediary layer.
3.1.1.3 Protocol Layer
Defines rules governing communication including error handling procedures.
3.1.1.4 Hubs
Discusses the role of hubs in managing connections and facilitating communication among multiple USB devices.
3.1.1.5 Power Management
Outlines strategies for conserving power while maintaining optimal performance levels.
3.2 USB 3.0 System
Includes comparison between SuperSpeed USB and its predecessor (USB 2.0), system level topology, bus protocol specifics, robustness features etc.
3.2.1 Comparing SuperSpeed USB to USB 2.0
Compares the two versions highlighting improvements in data transfer rates and overall performance.
3.2.2 System Level Topology
Describes how different components such as hosts, hubs, devices are interconnected within a system.
3.2.2.1 Hosts
Elaborates on functions of host controllers managing communication between USB peripheral devices and the computers main processor.
3.2.2.2 Hubs
Explains how these act as intermediaries routing data to multiple connected peripherals.
3.2.2.3 Devices
Details characteristics and roles played by various types of USB enabled gadgets.
3.2.3 Bus Protocol
Provides insight into the communication protocols governing interactions between devices on a shared bus.
3.2.4 Robustness
Highlights measures employed to ensure reliability such as error detection and handling mechanisms.
3.2.4.1 Error Detection
Methods used for identifying transmission errors or malfunctions during data transfer processes.
3.2.4.2 Error Handling
Procedures initiated upon detecting an issue to restore normal operation without disrupting the entire system.
3.2.5 Performance and Power Efficiency
Discusses strategies employed by SuperSpeed USB technology to enhance both speed of data transmission and energy conservation during use.
3.3 USB Specification Chapter Overview
Provides a brief summary of each chapter in the main specification document covering topics like mechanical specifications, physical layer details, link layer functionalities etc.
3.3.1 Mechanical
Addresses hardware aspects including connector design and cable requirements for compliance with SuperSpeed standards.
3.3.2 Physical Layer
Describes electrical characteristics necessary for data transmission at this level of the architecture.
3.3.3 Link Layer
Details how packets are organized, transmitted and received between devices over a USB link.
3.3.4 Protocol Layer
Defines rules governing communication including packet formats used in SuperSpeed operations.
3.3.5 Framework Layer
Discusses higher-level structures supporting overall system architecture and functionality.
3.3.6 Hubs
Focuses on hub-specific functionalities within the context of USB 3.0.
3.3.6.
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